Mutete Firimu Circuit Technology
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Mutete Firimu Circuit Technology

Thin Film Circuit Technology inoshandisa mafirimu matete deposition, photolithography, etching, and metallization process kuita micron-scale conductive lines pamusoro peceramic, girazi, kana silikoni{{1}based materials, zvichiita kuti -density, high{3}}ivimbike musanganiswa wemagetsi.
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Tsanangudzo

Technical Parameters

Product Sumo

 

Thin Film Circuit Technology inoshandisa mafirimu matete deposition, photolithography, etching, and metallization process kuita micron-scale conductive lines pamusoro peceramic, girazi, kana silikoni{{1}based materials, zvichiita kuti -density, high{3}}ivimbike musanganiswa wemagetsi.

 

Product Advantages

 

High Linear Precision:Uchishandisa precision photolithography uye vacuum deposition process, standard linewidth uye spacing inogona kusvika 20μm, nemapurojekiti akakosha anowana 10μm mazinga.

Low Signal LassHigh{{0}purity metal films thin films and fine line design zvinoderedza kusamira uye kurasikirwa kwekutapurirana, zvichiita kuti zvikodzere 5G communications, millimeter-wave, uye high-electronic systems.

Yakanakisa Heat Dissipation:Yakasanganiswa neakakwira yekupisa conductivity substrates senge alumina uye aluminium nitride, kupisa kunogona kukurumidza kubviswa, kuderedza tembiricha yemudziyo uye kugadzirisa kugadzikana kwehurongwa.

 

Sei Mutete Firimu Technology

Kubatanidzwa Kwepamusoro

Inotsigira-density circuit design, kuderedza saizi yechigadzirwa.

Superior Electrical Performance

Inoderedza kurasikirwa kwechiratidzo uye inovandudza kutapurirana zvakanaka.

Yakasimbiswa Thermal Management

Inovandudza kupisa kwekupisa kune zvigadzirwa zvemagetsi.

Upenyu Hwakareba

Inoderedza kukundikana uye mari yekugadzirisa.

 

Zvinhu Zvokusarudza

 

Substrate Materials:Alumina (Al₂O₃), Aluminium Nitride (AlN), Silicon Nitride (Si₃N₄), Girazi{{0}Ceramic.

Metal Systems:Ndarama, Sirivha, Mhangura, Nickel, Platinum, uye Tsika Multilayer Metal Structures.

 

Technology kugona

 

Mutete Firimu Deposition:Inotsigira kugadzirwa kweakasiyana simbi uye anoshanda mafirimu.

Precision Lithography:Inogonesa micron{0}}level circuit patterning.

Precision Etching:Inosimbisa chiyero chedunhu uye kuenderana.

Surface Metallization:Inotsigira goridhe plating, sirivheri plating, uye ENIG kugadzirisa.

Multilayer Kubatanidzwa:Inotsigira-layer, double-layer, uye madhizaini ezvimiro zvakawanda.

 

Zvidimbu zvehunyanzvi

 

Item

Tsanangudzo

Typical Line Width/Spacing

20/20 μm

Advanced Kugona

Kudzika kusvika 10/10 μm*

Substrate Zvishandiso

Al₂O₃, AlN, Si₃N₄, Girazi

Metal Systems

Au, Ag, Cu, Ni, Pt

Circuit Layers

Imwe / Kaviri / Multilayer

Operating Temperature

-55 kusvika 300 degree

Surface Finish

ENIG, Goridhe Plating, Silver Plating

Metallization Ukobvu

Customized

Custom Design

Available

 

Hunhu Hwakanaka

Quality System Management

Yakazara-maitiro ekudzora zvinoenderana ne ISO mwero.

Raw Material Traceability

Batch management uye{0}}yakazara maitiro ekutsvaga.

Kuvimbika Verification

Inotsigira thermal cycling, kunyorova kupisa, uye magetsi ekuita kuyedzwa.

Conformity Control

Inopa kugadzikana-kwenguva refu.

 

Application Industries

 

Semiconductor Packaging:Inoshandiswa kune-density interconnects uye advanced packaging substrates.

Power Electronics:Inoshandiswa muIGBTs, SiC, uye simba modules.

RF Kukurukurirana:Inokodzera 5G, millimeter-wave, uye radar masisitimu.

Zvemagetsi zvemotokari:Inoshandiswa mumotokari itsva dzesimba uye mota-magiredhi module.

Medical Electronics:Inoenderana nezvinodiwa zve-zvekutendeseka kwepamusoro midziyo yemagetsi.

Aerospace:Inokodzera-kupisa uye kuomarara kwemamiriro ekunze.

 

Customization kugona

 

Kudhirowa Customization:Inotsigira Gerber uye CAD faira kuvandudzwa.

Material Customization:Kusarudzwa kwezvinhu kunobva pane thermal conductivity uye magetsi ekuita zvinodiwa.

Kugadziridza Kwemaitiro:Inotsigira dhizaini uye-yakawanda dhizaini yezvimiro.

Muenzaniso kune Mass Production:Inopa imwe-masevhisi ekuvandudza.

 

Company Simba

 

20+ Makore eKugadzira Chiitiko
Yakatangwa muna 2003, inyanzvi muR&D uye kugadzira kwezvinhu zvitsva zvemukati, zvine makore anopfuura makumi maviri eruzivo rweindasitiri.

Yakagadzikana Kugadzira Kugona
Tine-zvakakura zvekugadzira uye hurongwa hwakakwana hwekugadzira, hunotsigira-kutenga kwakagadzikana kwenguva refu kubva kumakasitoma epasi rose.

Nyanzvi R&D Chikwata
Iine zvinhu R&D uye kuita optimization kugona, inopa yakagadziridzwa mhinduro.

Strict Quality Control
Yakashongedzerwa neyemhando yepamusoro yekuyedza michina, ichinyatso kudzora mhando yechigadzirwa uye batch kugadzikana.

Global Export Experience
Zvigadzirwa zvinotumirwa kumisika yemhiri kwemakungwa, zvine masevhisi akakura kunze kwenyika uye kugona kwevatengi.

Customized Solutions
Inotsigira kugadzirisa kwezvakatemwa zvechigadzirwa, kuita, uye zvinodiwa zvekushandisa kuti zvisangane nezvinodiwa nevatengi zvakasiyana.

 

FAQ

 

Mubvunzo: Ndezvipi zvinyorwa zve substrate zvaunogona kupa?

A: Tinogona kupa ma substrates akadai sealumina (Al₂O₃), aluminium nitride (AlN), silicon nitride (Si₃N₄), uye girazi-ceramic substrates, uye tinogona kurumbidza mhinduro dzakakodzera zvichienderana nekupisa kwemafuta, insulation, uye zvinodiwa mutengo.

Mubvunzo: Ndeupi hudiki mutsara uye mutsara wemutsara waunogona kuwana?

A: Yedu yakajairika kugadzirwa kugona ndeye 20/20μm. Yepamusoro chaiyo mhinduro inogona kupihwa kune yakakosha mapurojekiti, zvichienderana nekugadzirwa kwechigadzirwa uye maitiro ekuongorora.

Mubvunzo: Unotsigira here-layer uye yakawanda-layer yakatetepa-kugadzirwa kwemafirimu?

A: Tinotsigira single-layer, double-layer, uye multi-layer thin-film circuit structures, uye tinokwanisa kugadzirisa budiriro maererano nekubatanidza chigadzirwa uye zvinodiwa pakushandisa.

Mubvunzo: Unogona here kugadzirisa kugadzirwa kwakavakirwa pamifananidzo yemutengi?

A: Hongu. Isu tinotsigira Gerber, CAD, uye mamwe mafaera einjiniya, uye tinopa kuongorora kweDFM, kusarudzwa kwezvinhu, uye masevhisi ekugadzirisa.

Mubvunzo: Unotsigira here samples uye diki-batch trial production?

A: Tinotsigira kukurumidza kuita prototyping uye diki-kugadzira muyedzo webatch, tichibatsira vatengi kupfupisa magadzirirwo ekugadzirwa kwezvinhu uye kuderedza kutanga-njodzi dzeR&D.

Mubvunzo: Ndedzipi bvunzo dzekuvimbika dzichaitwa zvigadzirwa?

A: Tinogona kuitisa kupisa bhasikoro, kunyorova kupisa kuchembera, kunamatira, kuita kwemagetsi, uye kuvimbika kwezvakatipoteredza bvunzo zvinoenderana nezvinodiwa zvepurojekiti, uye kupa mishumo yakakodzera yebvunzo.

Mubvunzo: Ndeapi maindasitiri ayo zvigadzirwa zvedu zvakakodzera?

A: Inoshandiswa zvakanyanya mu semiconductor packaging, IGBT / SiC power modules, 5G kutaurirana, magetsi emotokari, midziyo yezvokurapa, uye aerospace.

Mubvunzo: Ndeipi kutenderera kwako kwekutumira?

A: Yakajairwa sampuli yekutumira nguva inowanzo 2-3 mavhiki. Nguva yekutumira yemaodha akawanda zvinoenderana nechimiro chechigadzirwa uye huwandu hwekurongeka. Tinogona kutsigira kukurumidza kugadzirwa kweprojekiti.

Mubvunzo: Unogona here kuvimbisa-nguva yakareba yakagadzikana?

A: Tine manejimendi emhando yepamusoro uye hurongwa hwekutengesa zvinhu kuti tizadzise zvinoramba zvichidiwa zvekushandisa zvemapurojekiti enguva refu-nevatengi vanotenga zvakawanda.

Mubvunzo: Unogona kusaina chibvumirano chekuvanzika (NDA)?

A: Hongu. Isu tinoremekedza kodzero dzevatengi vedu zvehungwaru uye tinogona kusaina zvibvumirano zveNDA, tichinyatso kuchengetedza kuchengetedzeka kwevatengi kudhirowa, magwaro ehunyanzvi, uye data reprojekiti.

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